Thermal Grizzly CPU-fläktar - sita 2

Thermal pads offer improved thermal conductivity, high compressibility and electrical insulation for reliable heat transfer on SSDs, GPU coolers and other electronic components.

The Minus Pad Advance series refines the proven Minus Pad 8 formula with enhanced thermal performance and easier handling, making it suitable for SSDs, GPU water coolers, voltage regulators and memory modules.

• Electrically non-conductive for safe component contact


• Excellent thermal conductivity to aid heat dissipation


• High compressibility for better surface conformity


• Easy to use on a variety of cooling applications

Designed to improve heat transfer in compact cooling setups while remaining simple to apply.

Water cooler for direct‑die mounting on AMD AM5 CPUs featuring a nickel‑plated copper cold plate, a hybrid microfin structure with a jet plate for optimized flow and integrated ARGB lighting.

The AMD Mycro Direct-Die Pro is engineered for delidded AM5 processors, replacing the SAM and heatspreader to sit directly on the silicon while the nickel plating limits gallium-based liquid metal diffusion and the hybrid fin design reduces flow resistance.

• Direct‑die mounting for delidded CPUs (requires removal of Socket Actuation Mechanism)


• Nickel‑plated copper cold plate with two sizes of microfins and jet plate


• Annealed acrylic under an anodized aluminum cover to prevent stress cracks


• Digital ARGB LEDs under the cover, controlled via 3‑pin ARGB header (+5V/DATA/GND); LEDs illuminate the acrylic and G1/4 connectors


• G1/4‑inch connections for coolant lines


• Compatibility: generally compatible with Ryzen 9000 series including X3D variants; not compatible with Ryzen 5 7400F or Ryzen 8000G APUs (As of September 2025)


• Includes insulation sheet, 600 mbar pressure test report, mounting screws and wrenches

Provides direct‑die cooling with optimized flow and integrated lighting while the nickel plating reduces the need for repeated liquid‑metal applications.

Termisk pasta, ljusgrå

CPU Contact Frame improves cooling by shifting contact pressure to the edges, preventing IHS concavity and enabling better cooler contact on Intel LGA1700 sockets.

The Thermal Grizzly CPU Contact Frame Intel 1700 LT is the injection-molded "Lite" mounting frame made from ABS reinforced with 15% glass fiber that replaces the standard ILM to increase contact surface and simplify installation.

• Injection-molded ABS with 15% glass fiber for added stability


• Inner contour shifts pressure from centre to edges to avoid concave IHS


• Designed for Intel LGA1700; compatible with 12th, 13th and 14th Gen CPUs


• Only for CPUs whose IHS has been ground down by no more than 0.2 mm


• Includes 4 pan-head screws (UNC 3/8"), 5/64" hex socket wrench and Torx T20 angle wrench

Simple installation and improved cooler contact can lead to noticeably lower CPU temperatures depending on the cooler and processor.

The Delid-Die-Mate Intel 13th Gen is a tool for removing the heat spreader ("delidden") on Intel processors for socket LGA1700. By removing the heat spreader, the CPUs can be cooled via "direct die", for example. With the so-called "direct die", the CPU cooler is mounted directly on the processor chip. By omitting the heat spreader in the cooling circuit, a significantly optimised heat transfer from the die to the CPU cooler is possible.

The electrically non-conductive Minus Pad Advanced thermal pads are part of the Minus Pad Basic, Advance, and Pro series. Based on the proven minus pad 8, this series has been specifically further developed to significantly improve thermal conductivity, compressibility, and price-performance ratio. The thermal pads are suitable for SSDs, GPU coolers, GPU water coolers, as well as electronic components such as voltage regulators and memory modules.

• Excellent thermal conductivity


• High compressibility


• Easy to use


• Electrically non-conductive

Comparison of the Minus Pad Basic-, Advance-, and Pro series:

• Minus Pad Basic: Good thermal conductivity, slightly lower compressibility, and excellent price-performance ratio.


• Minus Pad Advance: Improved thermal conductivity, higher compressibility.


• Minus Pad Pro: Outstanding thermal conductivity and exceptional compressibility – at a slightly higher Price.
   

Värmeledande platta, rödbrun (paket om 2 )

Thermal paste

Thermal Grizzly TG Shield is a high temperature conformal coating to protect components from liquid metal short circuits. TG Shield is fast drying for quick application and will provide reliable protection of PC components in combination with liquid metal.

Thermal Grizzly TG Remove is an acetone based nano-cleaner for the best cleaning results of thermal paste. In addition TG Remove has a degreasing effect which helps preparing the surface for new application e. g. on CPUs.

With the Thermal Grizzly Minus Pad Advance, the Hamburg-based cooling specialist is expanding its product range with advanced thermal pads. Based on their predecessor, the Minus Pad 8, they have been further developed to significantly improve thermal conductivity.

The Minus Pad Advance is ideal for applications where thermal paste is difficult to apply or where a gap between the heat source and the heat sink needs to be bridged. It is therefore ideal for use with memory chips or voltage converters. It is based on a silicone-based carrier complex and aluminum oxide as a heat transfer medium, thus achieving thermal conductivity similar to thermal paste.

The Minus Pad is available in various dimensions and thicknesses from 0.5 to 3 millimeters. Since it works optimally even with minimal contact pressure and thermal conductivity is barely affected by the thickness, the choice of thickness should simply be tailored to the distance to be bridged.

Kylpasta för processorkylfläns, silver

Termisk pad Thermal Grizzly Minus Pad 8 är ett rosa 2-pack kyl tillbehör med 8 W/m-K värmeledningsförmåga för värmeavledning från GPU, M.2 SSD och VRM.

Den är utformad för att överbrygga glapp mellan värmealstrande elektroniska komponenter och kylflänsar eller kyl ytor, med en keramik-silikon-komplex med nano-aluminiumoxid.

• Elektriskt icke-ledande material
• Lämplig för GPU-kylflänsar, M.2 SSD-kylflänsar och VRM-kylning
• Drifttemperaturområde från -100 °C till +250 °C
• RoHS-kompatibel design

Pålitligt stöd för värmeöverföring hjälper din kyl lösning att fungera effektivt där komponenter och kylflänsar behöver korrekt kontakt.

Termisk pasta, ljusgrå

Värmeledande platta, rödbrun

Grease spatula (paket om 3)

The electrically non-conductive Minus Pad Advanced thermal pads are part of the Minus Pad Basic, Advance, and Pro series. Based on the proven minus pad 8, this series has been specifically further developed to significantly improve thermal conductivity, compressibility, and price-performance ratio. The thermal pads are suitable for SSDs, GPU coolers, GPU water coolers, as well as electronic components such as voltage regulators and memory modules.

• Excellent thermal conductivity


• High compressibility


• Easy to use


• Electrically non-conductive

Comparison of the Minus Pad Basic-, Advance-, and Pro series:

• Minus Pad Basic: Good thermal conductivity, slightly lower compressibility, and excellent price-performance ratio.


• Minus Pad Advance: Improved thermal conductivity, higher compressibility.


• Minus Pad Pro: Outstanding thermal conductivity and exceptional compressibility – at a slightly higher Price.
   

CPU-kontaktram för Intel 13th Intel Raptor Lake och 14th gen Intel Raptor Lake-S, kan hjälpa till att förbättra kylprestanda med bättre kontakt mellan CPU och kylare - se installationsvideon innan du installerar

Värmeplattor ger hög värmeledningsförmåga med en mycket elastisk, flexibel yta som är utformad för att kompensera även de minsta gliporna mellan komponenter.

Thermal Grizzly Minus Pad 8 är lätt att bearbeta och fästa med lätt tryck, med en keramisk silikonformelkomplex och nanoaluminiumoxid för att stödja konstant, optimal värmeöverföring i ett brett utbud av storlekar och tjocklekar.

• Hög värmeledningsförmåga
• Hög kompressibilitet
• Elektrisk isolering
• RoHS-kompatibel

Tillförlitlig kontakt och effektiv värmeöverföring hjälper till att hålla känsliga komponenter termiskt anslutna och stabila.

Applikator flyrande metall, termisk pasta (paket om 3)

Termisk pad Thermal Grizzly Minus Pad extreme 2 levererar enastående värmeledningsförmåga och lågt termiskt gränssnittsmotstånd för högpresterande tillämpningar.

Thermal Grizzly Minus Pad extreme 2 är utformad för att fylla även de minsta gliporna med värmeledande partiklar tack vare en sammansättning av aluminiumoxid, aluminiumhydroxid och aluminiumpulver, vilket främjar optimal värmeöverföring mellan värmekälla och kylare.

• Högpresterande termisk pad för extrema tillämpningar
• Optimerad materialsammansättning för lågt termiskt gränssnittsmotstånd
• Mjuk konsistens anpassar sig väl till kontaktytor
• Elektriskt icke-ledande
• Härdar eller stelnar inte över tid, även vid långvarig användning

Pålitligt gränssnittsmaterial för stabil, effektiv värmeöverföring i krävande byggen.

Thermal paste, designed for Overclocking, 14.2 W/m*K thermal conductivity, no curing, 2 grams

Spatelsetet TG Spatula Pro (3-pack) säkerställer en jämn och exakt applicering av kylpasta på CPU:er, optimerat för att möjliggöra mer tryck vid utstrykning.

Dessa spatlar i mjuk plast är utformade för noggrann, jämn applicering av kylpastor med hög till mycket hög viskositet, minskar risken för repor eller ytskador och reagerar inte med metalliska komponenter i kylpastor.

• Praktiskt 3-pack
• Mjuk plast med lägre hårdhet än metallverktyg
• Slevliknande form för hög styvhet vid nedåtriktat tryck
• Kompatibel med Thermal Grizzly Duronaut, Aeronaut, Hydronaut, Kryonaut och Kryonaut Extreme

Hjälper till att uppnå en ren, konsekvent spridning för tillförlitliga resultat med kylpasta.

Värmeledande platta, rödbrun

The electrically non-conductive Minus Pad Advanced thermal pads are part of the Minus Pad Basic, Advance, and Pro series. Based on the proven minus pad 8, this series has been specifically further developed to significantly improve thermal conductivity, compressibility, and price-performance ratio. The thermal pads are suitable for SSDs, GPU coolers, GPU water coolers, as well as electronic components such as voltage regulators and memory modules.

• Excellent thermal conductivity


• High compressibility


• Easy to use


• Electrically non-conductive

Comparison of the Minus Pad Basic-, Advance-, and Pro series:

• Minus Pad Basic: Good thermal conductivity, slightly lower compressibility, and excellent price-performance ratio.


• Minus Pad Advance: Improved thermal conductivity, higher compressibility.


• Minus Pad Pro: Outstanding thermal conductivity and exceptional compressibility – at a slightly higher Price.