Thermal Grizzly CPU-fläktar - sita 2

Thermal putty is an electrically non-conductive, flexible gap filler that replaces conventional thermal pads on GPUs and bridges height differences from 0.2 to 3.0 mm.

Formulated for GPU modifications, TG Putty is easy to shape for precise contact with VRAM and SMD components and can be applied broadly with a spatula or formed by hand.

• Electrically non-conductive alternative to thermal pads


• Fills gaps from 0.2 to 3.0 mm for consistent contact


• Apply with spatulas or by hand (gloves recommended)


• Available in variants with different thermal conductivities


• Operating range −40°C to +120°C


• Not suitable for use on processors (IHS or direct die) or directly on the GPU die

Easy to shape and tailor-made for memory and voltage-regulator contacts, it simplifies GPU pad replacement and cooler modifications.

Värmeledande platta, rödbrun

CPU-kontaktram för Intel 13th Intel Raptor Lake och 14th gen Intel Raptor Lake-S, kan hjälpa till att förbättra kylprestanda med bättre kontakt mellan CPU och kylare - se installationsvideon innan du installerar

With the Thermal Grizzly Minus Pad Advance, the Hamburg-based cooling specialist is expanding its product range with advanced thermal pads. Based on their predecessor, the Minus Pad 8, they have been further developed to significantly improve thermal conductivity.

The Minus Pad Advance is ideal for applications where thermal paste is difficult to apply or where a gap between the heat source and the heat sink needs to be bridged. It is therefore ideal for use with memory chips or voltage converters. It is based on a silicone-based carrier complex and aluminum oxide as a heat transfer medium, thus achieving thermal conductivity similar to thermal paste.

The Minus Pad is available in various dimensions and thicknesses from 0.5 to 3 millimeters. Since it works optimally even with minimal contact pressure and thermal conductivity is barely affected by the thickness, the choice of thickness should simply be tailored to the distance to be bridged.

Värmeplattor ger hög värmeledningsförmåga med en mycket elastisk, flexibel yta som är utformad för att kompensera även de minsta gliporna mellan komponenter.

Thermal Grizzly Minus Pad 8 är lätt att bearbeta och fästa med lätt tryck, med en keramisk silikonformelkomplex och nanoaluminiumoxid för att stödja konstant, optimal värmeöverföring i ett brett utbud av storlekar och tjocklekar.

• Hög värmeledningsförmåga
• Hög kompressibilitet
• Elektrisk isolering
• RoHS-kompatibel

Tillförlitlig kontakt och effektiv värmeöverföring hjälper till att hålla känsliga komponenter termiskt anslutna och stabila.

Thermal paste, designed for Overclocking, 14.2 W/m*K thermal conductivity, no curing, 2 grams

The graphene thermal pads of the Thermal Grizzly KryoSheet series can be used as an excellent alternative for thermal compounds from the higher performance segment. Similar to Carbonaut pads, they have a conformable surface with very high thermal conductivity. Compared to Carbonaut pads, KryoSheet as a high-end product offers significantly higher thermal conductivity.

This increased thermal conductivity is not only due to the choice of material, but also to the innovative manufacturing process. KryoSheet does not contain any liquid components and is therefore not subject to normal ageing as is the case with traditional thermal paste. Drying out is not possible.

• Outstanding thermal conductivity
• Easy to use
• Consistently high performance
• Extreme durability

Attention: Electrically conductive! Follow instructions!

Termisk pasta, ljusgrå

Flytande metall kylpasta, silverpasta, densitet: 6,29 g/cm³, driftstemperatur: -50 - 200° C, 5 gram

Värmeledande platta, rödbrun

Thermal Grizzly TG Remove is an acetone based nano-cleaner for the best cleaning results of thermal paste. In addition TG Remove has a degreasing effect which helps preparing the surface for new application e. g. on CPUs.

The electrically non-conductive Minus Pad Advanced thermal pads are part of the Minus Pad Basic, Advance, and Pro series. Based on the proven minus pad 8, this series has been specifically further developed to significantly improve thermal conductivity, compressibility, and price-performance ratio. The thermal pads are suitable for SSDs, GPU coolers, GPU water coolers, as well as electronic components such as voltage regulators and memory modules.

• Excellent thermal conductivity


• High compressibility


• Easy to use


• Electrically non-conductive

Comparison of the Minus Pad Basic-, Advance-, and Pro series:

• Minus Pad Basic: Good thermal conductivity, slightly lower compressibility, and excellent price-performance ratio.


• Minus Pad Advance: Improved thermal conductivity, higher compressibility.


• Minus Pad Pro: Outstanding thermal conductivity and exceptional compressibility – at a slightly higher Price.
   

Digitalt skjutmått TG Caliper mäter upp till 150 mm / 6 inches med LCD-avläsning i mm eller inches, ZERO-funktion samt mätning av ytter-, inner-, steg- och djupmått för PC DIY-uppgifter.

Skjutmåttet är tillverkat av ABS-plast med hög hårdhet, är rostbeständigt, damm- och stänkskyddat enligt IP54 och har ett ergonomiskt texturerat tumstöd för enklare hantering.

• Upplösning/avläsning på 0.1 mm / 0.01 inch
• Noggrannhet på ±0.2 mm / 0.01 inch
• Lämplig för termiska pads, skruvar och rörväggstjocklek
• Drivs av LR44-batteri med extra batteri inkluderat

Med tydliga digitala avläsningar och praktiska mätfunktioner gör TG Caliper exakta PC DIY-komponentkontroller enkla.

Termisk pasta Thermal Grizzly Duronaut Pro erbjuder utmärkt värmeledningsförmåga, extrem långsiktig stabilitet, elektriskt icke-ledande användning och ingen härdning över tid.

Duronaut Pro är en avancerad termisk pasta utvecklad för gamers, överklockare och krävande industriella kylsystem, med silikonolja och aluminiummikropulver samt zinkoxid-nanopulver.

• Minimerar pump-out-effekten med optimerad partikel form och storlek
• Stödjer tunna appliceringslager för lågt termiskt kontaktmotstånd
• Inkluderar applicator, TG Spatula och TG Spatula Pro
• Innehåll: 2 g

Duronaut Pro är utformad för effektiv värmeöverföring mellan värmekälla och kylare och hjälper till att bibehålla pålitlig kylprestanda över tid.

The Intel 1851 Delid-Die-Mate V1 is a tool for removing the heat spreader (delidding) from Intel processors in the "Intel Core Ultra 200" series (LGA1851 socket). By removing the Integrated Heat Spreader (IHS), CPUs can be cooled using the "Direct-Die" method, where the cooler is mounted directly onto the processor chip. This enables the most efficient transfer of thermal dissipation power (TDP), or simply put, the heat, from the processor to the cooling loop.

 

Caution: Removing the heat spreader (delidding) of a processor is done at your own risk! Delidding the CPU voids the manufacturer's warranty! Damage caused during delidding is not covered by the manufacturer! CPU should be heated. 

Grease spatula (paket om 3)

CPU contact frame for LGA 1851 (Intel 200 series). Can help improve cooling performance with better contact between CPU and cooler.

 Included in the package:

• 1x Intel 1851 CPU Contact Frame V1
• 4x Cylinder head screws with 3/8" UNC threads
• 1x 5/64" hex key
• 1x Torx T20 key

Värmeplatta ger mycket hög kompressibilitet med utmärkt värmeledningsförmåga, utformad för att överbrygga varierande höjdskillnader över flera kontaktpunkter.

TG Minus Pad High Compression är särskilt praktisk för grafikkortsmodifikationer med en GPU-vattenkylare eller vid byte av GPU-kylarnas värmeplattor, eftersom en platta kan betjäna komponenter som VRAM, spänningsregulatorer och andra kontaktytor i samma uppsättning – även när den exakta erforderliga tjockleken är okänd.

• Behåller värmeledningsförmågan under kraftig kompression och kan till och med öka vid högre kontakttryck
• Anpassar sig väl till höjdtoleranser
• Elektriskt icke-ledande
• Mycket mångsidig och lätt att hantera

Hjälper till att säkerställa konsekvent kontakt och effektiv värmeöverföring över blandade komponenthöjder.

Värmeledande platta, rödbrun

Short back plate for AM5 motherboard, for mounting AM4 coolers with custom retaining kit on AM5, made from black anodised aluminium

Water cooler optimized for Intel LGA1851 direct-die mounting with a nickel-plated copper microfin cold plate, low-flow-resistance jet channels and integrated RGB lighting.

The Intel 1851 Mycro Direct-Die Pro RGB V1 is designed to sit directly on a delidded Intel CPU to send heat straight into the water loop, with an acrylic-and-aluminum cover and controllable ARGB illumination.

• Direct-die installation for LGA1851 CPUs — requires removal of the ILM and CPU heatspreader; delidding is at your own risk


• Nickel-plated copper cold plate with microfins and a jet system, engineered for low flow resistance


• Acrylic layer tempered after milling to prevent stress cracks beneath the anodized aluminum lid


• Digital aRGB LEDs under the lid, controllable via a 3-pin ARGB header (+5V/DATA/GND); LEDs also illuminate the G1/4 fittings


• G1/4-inch female threading for standard fittings


• Tested with KryoSheet and thermal pads — additional pad thickness affected contact pressure and showed no significant temperature improvements

Built for users who want a compact direct cooling path from the CPU die into a water loop while retaining customizable RGB lighting.

Thermal Grizzly Duronaut is a high-performance thermal paste designed for excellent heat transfer and long-term stability.

Key features:
✔ Extremely durable
✔ High thermal conductivity
✔ Non-conductive & safe for electronics

Package includes:

1x Duronaut thermal paste 6g
1x Applicator
1x TG Spatula
1x TG Spatula Pro
 

Termisk pasta, ljusgrå

Värmeledande platta, rödbrun

Thermal pad with extremely high thermal conductivity and outstanding compressibility, electrically non-conductive and easy to apply for efficient heat transfer in electronic components.

The Minus Pad Pro builds on the proven Minus Pad 8 to deliver improved thermal performance and surface conformity, making it suitable for SSDs, GPU coolers, water-cooling blocks, voltage regulators and memory modules.

• Excellent thermal conductivity


• Outstanding compressibility for better surface contact


• Electrically non-conductive


• Easy to use and install


• Designed for use with SSDs, GPUs, water coolers and electronic components


• Part of the Minus Pad Basic, Advance and Pro series; further developed from Minus Pad 8

Gray material adapts to uneven surfaces to improve contact between components and heatsinks for more reliable heat transfer.