Thermal Grizzly CPU-fläktar - sita 4

Värmeplatta ger exceptionellt hög kompressibilitet med utmärkt värmeledningsförmåga, utformad för att anpassa sig till varierande höjdskillnader mellan komponenter.

TG Minus Pad High Compression är särskilt praktisk för grafikkortsmodifikationer med en GPU-vattenkylare eller vid byte av plattor på en GPU-kylare, eftersom en platta kan överbrygga flera toleranser på VRAM, spänningsregulatorer och andra kontaktytor i samma uppsättning.

• Behåller värmeledningsförmågan under kraftig kompression och kan öka vid högre kontakttryck
• Anpassar sig väl till höjdtoleranser när exakt plattjocklek är okänd
• Elektriskt icke-ledande
• Lätt att hantera och mycket mångsidig i användning

Ger tillförlitlig kontakt över ojämna ytor för mer konsekvent värmeöverföring i krävande byggen.

Water cooler optimized for Intel LGA1851 direct-die mounting with a nickel-plated copper microfin cold plate, low-flow-resistance jet channels and integrated RGB lighting.

The Intel 1851 Mycro Direct-Die Pro RGB V1 is designed to sit directly on a delidded Intel CPU to send heat straight into the water loop, with an acrylic-and-aluminum cover and controllable ARGB illumination.

• Direct-die installation for LGA1851 CPUs — requires removal of the ILM and CPU heatspreader; delidding is at your own risk


• Nickel-plated copper cold plate with microfins and a jet system, engineered for low flow resistance


• Acrylic layer tempered after milling to prevent stress cracks beneath the anodized aluminum lid


• Digital aRGB LEDs under the lid, controllable via a 3-pin ARGB header (+5V/DATA/GND); LEDs also illuminate the G1/4 fittings


• G1/4-inch female threading for standard fittings


• Tested with KryoSheet and thermal pads — additional pad thickness affected contact pressure and showed no significant temperature improvements

Built for users who want a compact direct cooling path from the CPU die into a water loop while retaining customizable RGB lighting.

Thermal Grizzly Minus Pad Extreme is a great choice for applications where renewing thermal paste is not an option. This is particularly useful when distances between the heat source and the heat sink need to be bridged - for example with memory chips and voltage converters. The silicone-based thermal pad has a consistency similar to modeling clay. Compared to Minus pad 8 the thermal conductivity was improved by about 260 %.

• Most excellent thermal conductivity
• No bleeding
• long-term stability
• high compression rate

The minus pad extreme is available in size 120 x 20 mm and 100 x 100 mm with thicknesses of 0,5mm, 1mm, 1,5mm, 2mm, 3mm. See variants for various sizes and thickness. 

NB: Due to the consistency only one-time use is recommended 

GPU-vattenblock för Asus ROG Astral GeForce RTX 5090 har en ultrahögpresterande kylplatta, riktad VRAM- och VRM-kylning samt ett svart anodiserat aluminiumhölje med RGB-belysning.

DeltaMate GPU Block använder en design med dubbla kylplattor med nickelpläterade kopparkontaktytor som är CNC-bearbetade för effektiv värmeöverföring.

• Ultrahögpresterande mikrofin-kylplatta
• Hel metallkonstruktion med belyst visningsfönster
• Direkt mässingsterminal med ett inlopp och ett utlopp
• Inkluderar Thermal Grizzly termisk pasta och termiska pads

Det medföljande “The Oracle” spacer PCB hjälper till att kontrollera passform och planera en anpassad vätskekylningsloop före installation.

Thermal Grizzly Minus Pad Extreme is a great choice for applications where renewing thermal paste is not an option. This is particularly useful when distances between the heat source and the heat sink need to be bridged - for example with memory chips and voltage converters. The silicone-based thermal pad has a consistency similar to modeling clay. Compared to Minus pad 8 the thermal conductivity was improved by about 260 %.

• Most excellent thermal conductivity
• No bleeding
• long-term stability
• high compression rate

The minus pad extreme is available in size 120 x 20 mm and 100 x 100 mm with thicknesses of 0,5mm, 1mm, 1,5mm, 2mm, 3mm. See variants for various sizes and thickness. 

NB: Due to the consistency only one-time use is recommended 

The AM5 Lapping-Tool was developed for grinding the heat spreaders of the AM5 processor series from AMD. The tolerances of the AM5 Lapping-Tool allow a gradual grinding of the heat spreader by 0.4 millimetres, up to a total height of 1.6 millimetres. When using the normal AMD mounting frame (SAM), a maximum sanding of 1.0 mm is provided until the middle steps are reached. A further 0.6 mm is only possible if the CPU is mounted e.g. with a suitable AM5 Contact Frame.

The graphene thermal pads of the Thermal Grizzly KryoSheet series can be used as an excellent alternative for thermal compounds from the higher performance segment. Similar to Carbonaut pads, they have a conformable surface with very high thermal conductivity. Compared to Carbonaut pads, KryoSheet as a high-end product offers significantly higher thermal conductivity.

This increased thermal conductivity is not only due to the choice of material, but also to the innovative manufacturing process. KryoSheet does not contain any liquid components and is therefore not subject to normal ageing as is the case with traditional thermal paste. Drying out is not possible.

• Outstanding thermal conductivity
• Easy to use
• Consistently high performance
• Extreme durability

Attention: Electrically conductive! Follow instructions!

Thermal pads offering improved thermal conductivity, high compressibility and electrical non-conductivity for reliable heat transfer on SSDs, GPU coolers and electronic components.

The Minus Pad Advance series refines proven Minus Pad technology to deliver easy-to-use, conformable pads that enhance heat transfer while remaining electrically non-conductive.

• Excellent thermal conductivity


• High compressibility for gap filling


• Electrically non-conductive


• Easy to use


• Suitable for SSDs, GPU coolers, GPU water coolers, voltage regulators and memory modules


• Black color

Designed to improve thermal contact between components and heatsinks for more consistent cooling performance.

Carbonaut pad is a carbon fiber thermal pad, used instead of thermal paste, thermal conductivity: 62.5 W / (mK), size: 31x25 and compatible with NVIDIA GPU's (GeForce RTX 2080)

Testbänk med aktivt PCB kombinerar en modulär ram med integrerad fläkt- och pumpstyrning, bred anslutningsmöjlighet och inbyggda lagringsalternativ för smidig hårdvarutestning.

der8enchtable är en professionell testbänk utvecklad i samarbete med ElmorLabs och der8auer, med fästen för radiator och PSU samt ett integrerat PCB som ansluter din testhårdvara, leder USB och ger praktiska reglage som power och reset.

• 3+1 styrzoner för fläktar och AIO:er med flera 4-pin-headers och moderkortshantering
• USB-anslutning via 4× USB 2.0 Type-A och 2× USB 2.0 Type-C-portar
• Inbyggt lagringsstöd för upp till två 2,5-tums SSD:er samt fyra microSD-platser
• Flexibel plattform med ATX-distanser som kan omkonfigureras för Micro-ATX och Mini-ITX, kompatibel med luft- och AIO-kylare

Utformad för att förenkla repeterbara tester och benchmarking, håller den kabeldragning, kylstyrning och hantering av testmedia organiserat i en kompakt uppsättning.

Carbonaut pad is a carbon fiber thermal pad, used instead of thermal paste, thermal conductivity: 62.5 W / (mK), size: 38x38 and compatible with Intel LGA20xx socket & AMD AM4 socket

Termisk pasta, grå , 10ml / 26g

Värmeledande platta, antracit

Värmeledande platta, rödbrun

Värmeledande platta, svart (paket om 4)

Termisk pad Thermal Grizzly Minus Pad extreme 2 levererar enastående värmeledningsförmåga och lågt termiskt gränssnittsmotstånd för högpresterande tillämpningar.

Thermal Grizzly Minus Pad extreme 2 är utformad för att fylla även de minsta gliporna med värmeledande partiklar tack vare en sammansättning av aluminiumoxid, aluminiumhydroxid och aluminiumpulver, vilket hjälper till att främja optimal värmeöverföring mellan värmekälla och kylare.

• Optimerad materialsammansättning för lågt termiskt gränssnittsmotstånd
• Mjuk konsistens anpassar sig väl till kontaktytor
• Elektriskt icke-ledande
• Härdar eller stelnar inte över tid, även vid långvarig användning
• Högpresterande termisk pad för extrema tillämpningar

Utformad för att stödja stabil termisk prestanda där effektiv värmeöverföring är som viktigast.

The practical AM5 Adapter & Offset Mounting Kit for AMD‘s socket AM5 motherboards includes cooler brackets for offset mounting of the CPU as well as adapter screws from UNC 6-32 to M3 and M4 threads respectively. The adapter screws can be used to mount CPU coolers that require an M3 or M4 thread instead of the UNC 6-32 thread of the mounting screws of the cooler bracket, as is the case with various AIOs or water coolers. With the offset brackets, compatible CPU coolers can optionally be mounted offset on the processor to optimise cooling performance. Since the introduction of the chiplet design in Ryzen CPUs, the hottest point of the heat spreader is no longer in the middle, but has been offset slightly downwards and, depending on the CPU, towards the edge.

Värmeledande platta

The Intel 1851 Delid-Die-Mate Heater V1 is a specially designed heating element for the Intel 1851 Delid-Die-Mate V1. The heater raises the temperature of both the CPU and the delidder to 165°C, the necessary temperature for delidding. The operation is controlled via a control unit with an OLED display, which is connected to the heater with two cables. A laptop/smartphone charger with at least 65 watts of power and a USB Type-C connector, which is not included, is required for the heater to operate. A small amount of thermal paste is also needed.

Heating element for warming the CPU
Designed for the Intel 1851 Delid-Die-Mate V1
Follow the warning instructions!
Scope of Delivery:

1x Intel 1851 Delid-Die-Mate Heater V1
1x Angle wrench
1x TG Cleaning Wipes
1x Kryonaut, 1g
Warning Instructions:

Note: When delidding with the Intel 1851 Delid-Die-Mate V1, the CPU should be heated to 165°C (the melting point of indium is 157°C) to liquefy the indium, making it easier to remove the heat spreader. This minimizes mechanical stress on the chip and helps prevent damage. Otherwise, there is a high risk that the CPU could be damaged during delidding.

Caution: delidding a CPU can be dangerous. Any damaged caused by this will not be covered by warranty. Make sure to ressearch how to before trying. 

Thermal paste

The heat spreader of the Ryzen 7000 processors is very thick, which is partly due to compatibility with older CPU coolers for the AM4 socket. The unnecessary thickness of the heat spreader reduces thermal conductivity, so the CPUs operate at very high temperatures, around 95 degrees Celsius. By removing the heat spreader ("decap", "delidding"), the CPU cooler can be mounted directly on the chiplets of Ryzen 7000 CPU, which drastically reduces temperatures. To avoid damage to sensitive chips and prevent operational problems (e.g., RAM), Ryzen 7000 Direct Die Frame replaces Socket Actuation Mechanism (SAM) on motherboard.

Värmeledande platta, svart (paket om 2)

Värmeledande platta, svart (paket om 4)

Flytande metall kylpasta, silverpasta, densitet: 6,29 g/cm³, driftstemperatur: -50 - 200° C, 5 gram

Thermal Grizzly Minus Pad Extreme is a great choice for applications where renewing thermal paste is not an option. This is particularly useful when distances between the heat source and the heat sink need to be bridged - for example with memory chips and voltage converters. The silicone-based thermal pad has a consistency similar to modeling clay. Compared to Minus pad 8 the thermal conductivity was improved by about 260 %.

• Most excellent thermal conductivity
• No bleeding
• long-term stability
• high compression rate

The minus pad extreme is available in size 120 x 20 mm and 100 x 100 mm with thicknesses of 0,5mm, 1mm, 1,5mm, 2mm, 3mm. See variants for various sizes and thickness. 

NB: Due to the consistency only one-time use is recommended