Thermal Grizzly CPU-fläktar - sita 4

Thermal Grizzly Hydronaut - 1g - Kylpasta

Thermal Grizzly Aeronaut - 1g - Kylpasta

Thermal Grizzly Carbonaut - 25x25mm - Termisk platta

Thermal Grizzly Minus Pad 8 - 120×20×1mm - Termisk platta

Thermal Grizzly Conductonaut - 1g - Kylpasta

Thermal Grizzly Minus Pad Extreme - 120 X 20 X 1.5 mm - Termisk platta

Thermal Grizzly Minus Pad Extreme is a great choice for applications where renewing thermal paste is not an option. This is particularly useful when distances between the heat source and the heat sink need to be bridged - for example with memory chips and voltage converters. The silicone-based thermal pad has a consistency similar to modeling clay. Compared to Minus pad 8 the thermal conductivity was improved by about 260 %.

• Most excellent thermal conductivity
• No bleeding
• long-term stability
• high compression rate

The minus pad extreme is available in size 120 x 20 mm and 100 x 100 mm with thicknesses of 0,5mm, 1mm, 1,5mm, 2mm, 3mm. See variants for various sizes and thickness. 

NB: Due to the consistency only one-time use is recommended 

Thermal Grizzly KryoSheet thermal pad - 50 x 50 mm - Termisk platta

The graphene thermal pads of the Thermal Grizzly KryoSheet series can be used as an excellent alternative for thermal compounds from the higher performance segment. Similar to Carbonaut pads, they have a conformable surface with very high thermal conductivity. Compared to Carbonaut pads, KryoSheet as a high-end product offers significantly higher thermal conductivity.

This increased thermal conductivity is not only due to the choice of material, but also to the innovative manufacturing process. KryoSheet does not contain any liquid components and is therefore not subject to normal ageing as is the case with traditional thermal paste. Drying out is not possible.

• Outstanding thermal conductivity


• Easy to use


• Consistently high performance


• Extreme durability
  
  

Thermal Grizzly Intel 1851 CPU Contact Frame V1 - Modding

CPU contact frame for LGA 1851 (Intel 200 series). Can help improve cooling performance with better contact between CPU and cooler.

 Included in the package:

• 1x Intel 1851 CPU Contact Frame V1
• 4x Cylinder head screws with 3/8" UNC threads
• 1x 5/64" hex key
• 1x Torx T20 key

Thermal Grizzly Polartherm X-10 - 2g - Kylpasta

Kylpasta X-10 levererar utmärkt värmeledningsförmåga med lågt motstånd och högre viskositet för sval, tyst och stabil drift under krävande arbetsbelastningar.

X-10 bygger på ett förbättrat silikonoljebaserat bärarmaterial med en högre koncentration av aluminium- och zinkoxidpulver och är utformad för optimal värmeöverföring vid CPU- och GPU-kylning i både luft- och vätskekylningssystem, med enkel applicering för både nybörjare och erfarna byggare.

• Högviskös formula utformad för processorer med hög värmeutveckling och motstånd mot pump-out-effekten
• Silikonbaserad blandning, inte elektriskt ledande
• Appliceringshjälpmedel ingår: applikator och spatel med flera appliceringsmetoder

Hjälper till att upprätthålla tillförlitlig, konsekvent kylning för stabil prestanda när systemet är under belastning.

Thermal Grizzly Minus Pad Basic - 120x20x2.0 mm 4 pcs - Termisk platta

Thermal Grizzly Intel 1851 Delid-Die-Mate V1

The Intel 1851 Delid-Die-Mate V1 is a tool for removing the heat spreader (delidding) from Intel processors in the "Intel Core Ultra 200" series (LGA1851 socket). By removing the Integrated Heat Spreader (IHS), CPUs can be cooled using the "Direct-Die" method, where the cooler is mounted directly onto the processor chip. This enables the most efficient transfer of thermal dissipation power (TDP), or simply put, the heat, from the processor to the cooling loop.

Caution: Removing the heat spreader (delidding) of a processor is done at your own risk! Delidding the CPU voids the manufacturer's warranty! Damage caused during delidding is not covered by the manufacturer! CPU should be heated. 

Thermal Grizzly Intel 1851 Mycro Direct-Die Pro RG

Water cooler optimized for Intel LGA1851 direct-die mounting with a nickel-plated copper microfin cold plate, low-flow-resistance jet channels and integrated RGB lighting.

The Intel 1851 Mycro Direct-Die Pro RGB V1 is designed to sit directly on a delidded Intel CPU to send heat straight into the water loop, with an acrylic-and-aluminum cover and controllable ARGB illumination.

• Direct-die installation for LGA1851 CPUs — requires removal of the ILM and CPU heatspreader; delidding is at your own risk


• Nickel-plated copper cold plate with microfins and a jet system, engineered for low flow resistance


• Acrylic layer tempered after milling to prevent stress cracks beneath the anodized aluminum lid


• Digital aRGB LEDs under the lid, controllable via a 3-pin ARGB header (+5V/DATA/GND); LEDs also illuminate the G1/4 fittings


• G1/4-inch female threading for standard fittings


• Tested with KryoSheet and thermal pads — additional pad thickness affected contact pressure and showed no significant temperature improvements

Built for users who want a compact direct cooling path from the CPU die into a water loop while retaining customizable RGB lighting.

Thermal Grizzly Aeronaut - 3.9g - Kylpasta

Thermal Grizzly Aeronaut - 7.8g - Kylpasta

Thermal Grizzly Minus Pad Extreme - 100 X 100 X 0.5 mm - Termisk platta

Thermal Grizzly Minus Pad Extreme is a great choice for applications where renewing thermal paste is not an option. This is particularly useful when distances between the heat source and the heat sink need to be bridged - for example with memory chips and voltage converters. The silicone-based thermal pad has a consistency similar to modeling clay. Compared to Minus pad 8 the thermal conductivity was improved by about 260 %.

• Most excellent thermal conductivity
• No bleeding
• long-term stability
• high compression rate

The minus pad extreme is available in size 120 x 20 mm and 100 x 100 mm with thicknesses of 0,5mm, 1mm, 1,5mm, 2mm, 3mm. See variants for various sizes and thickness. 

NB: Due to the consistency only one-time use is recommended 

Thermal Grizzly Minus Pad Pro - 120x20x0.5 mm 2 pc - Termisk platta

Thermal pads offer extremely high thermal conductivity, outstanding compressibility, electrical insulation, and straightforward installation for efficient component cooling.

The Minus Pad Pro is the Pro-series thermal pad refined from the Minus Pad 8 to deliver improved thermal conductivity and compressibility for SSDs, GPU coolers, water blocks and electronic components.

• Excellent thermal conductivity


• Outstanding compressibility for tight contact


• Electrically non-conductive


• Easy to apply


• Suitable for SSDs, GPU coolers, GPU water coolers, voltage regulators and memory modules

Designed to enhance heat transfer between components and cooling solutions in compact assemblies.

Thermal Grizzly Minus Pad Extreme - 100 X 100 X 3 mm - Termisk platta

Thermal Grizzly Minus Pad Extreme is a great choice for applications where renewing thermal paste is not an option. This is particularly useful when distances between the heat source and the heat sink need to be bridged - for example with memory chips and voltage converters. The silicone-based thermal pad has a consistency similar to modeling clay. Compared to Minus pad 8 the thermal conductivity was improved by about 260 %.

• Most excellent thermal conductivity
• No bleeding
• long-term stability
• high compression rate

The minus pad extreme is available in size 120 x 20 mm and 100 x 100 mm with thicknesses of 0,5mm, 1mm, 1,5mm, 2mm, 3mm. See variants for various sizes and thickness. 

NB: Due to the consistency only one-time use is recommended 

Thermal Grizzly Minus Pad Pro - 100x100x1.5 mm - Termisk platta

The electrically non-conductive Minus Pad Advanced thermal pads are part of the Minus Pad Basic, Advance, and Pro series. Based on the proven minus pad 8, this series has been specifically further developed to significantly improve thermal conductivity, compressibility, and price-performance ratio. The thermal pads are suitable for SSDs, GPU coolers, GPU water coolers, as well as electronic components such as voltage regulators and memory modules.

• Excellent thermal conductivity


• High compressibility


• Easy to use


• Electrically non-conductive

Comparison of the Minus Pad Basic-, Advance-, and Pro series:

• Minus Pad Basic: Good thermal conductivity, slightly lower compressibility, and excellent price-performance ratio.


• Minus Pad Advance: Improved thermal conductivity, higher compressibility.


• Minus Pad Pro: Outstanding thermal conductivity and exceptional compressibility – at a slightly higher Price.
   

Thermal Grizzly Minus Pad Basic - 120x20x3.0 mm 4 pcs - Termisk platta

Thermal Grizzly Carbonaut - 31x25mm - Termisk platta

Thermal Grizzly Minus Pad Extreme - 120 X 20 X 1 mm - Termisk platta

Thermal Grizzly Minus Pad Extreme is a great choice for applications where renewing thermal paste is not an option. This is particularly useful when distances between the heat source and the heat sink need to be bridged - for example with memory chips and voltage converters. The silicone-based thermal pad has a consistency similar to modeling clay. Compared to Minus pad 8 the thermal conductivity was improved by about 260 %.

• Most excellent thermal conductivity
• No bleeding
• long-term stability
• high compression rate

The minus pad extreme is available in size 120 x 20 mm and 100 x 100 mm with thicknesses of 0,5mm, 1mm, 1,5mm, 2mm, 3mm. See variants for various sizes and thickness. 

NB: Due to the consistency only one-time use is recommended 

Thermal Grizzly Lapping Tool for Intel 13. Generat - Modding

Thermal Grizzly Lapping Tool for 12th Gen CPU Contact Frame - Modding

Thermal Grizzly Shield Protective varnish - 5ml - Modding

Thermal Grizzly Minus Pad HC 120x100x1 mm 2 pcs

Värmeplatta ger mycket hög kompressibilitet med utmärkt värmeledningsförmåga, utformad för att överbrygga varierande höjdskillnader över flera kontaktpunkter.

TG Minus Pad High Compression är särskilt praktisk för grafikkortsmodifikationer med en GPU-vattenkylare eller vid byte av GPU-kylarnas värmeplattor, eftersom en platta kan betjäna komponenter som VRAM, spänningsregulatorer och andra kontaktytor i samma uppsättning – även när den exakta erforderliga tjockleken är okänd.

• Behåller värmeledningsförmågan under kraftig kompression och kan till och med öka vid högre kontakttryck
• Anpassar sig väl till höjdtoleranser
• Elektriskt icke-ledande
• Mycket mångsidig och lätt att hantera

Hjälper till att säkerställa konsekvent kontakt och effektiv värmeöverföring över blandade komponenthöjder.