Thermal Grizzly CPU-fläktar - sita 3

The electrically non-conductive Minus Pad Advanced thermal pads are part of the Minus Pad Basic, Advance, and Pro series. Based on the proven minus pad 8, this series has been specifically further developed to significantly improve thermal conductivity, compressibility, and price-performance ratio. The thermal pads are suitable for SSDs, GPU coolers, GPU water coolers, as well as electronic components such as voltage regulators and memory modules.

• Excellent thermal conductivity
• High compressibility
• Easy to use
• Electrically non-conductive

Comparison of the Minus Pad Basic-, Advance-, and Pro series:

• Minus Pad Basic: Good thermal conductivity, slightly lower compressibility, and excellent price-performance ratio.
• Minus Pad Advance: Improved thermal conductivity, higher compressibility.
• Minus Pad Pro: Outstanding thermal conductivity and exceptional compressibility – at a slightly higher Price.
   

Thermal pads deliver electrically non-conductive heat transfer with improved thermal conductivity, high compressibility and straightforward application.

The Minus Pad Advance series builds on the proven Minus Pad 8 and offers enhanced thermal conductivity and compressibility compared to the Basic pads, suitable for SSDs, GPU coolers, GPU water coolers, voltage regulators and memory modules.

• Electrically non-conductive material


• Improved thermal conductivity


• High compressibility for uneven surfaces


• Easy to use and cut to size


• Size: 120 x 20 mm · Thickness: 2.0 mm · Color: black


• Pack content: 4 pcs

Ideal for reliable thermal coupling across a range of electronic components where consistent heat transfer is needed.

Värmeplattor från serien TG Minus Pad High Compression kombinerar exceptionellt hög kompressibilitet med utmärkt värmeledningsförmåga, även under kraftig kompression.

Dessa plattor är utformade för att överbrygga varierande höjdskillnader och är särskilt användbara vid modifiering av grafikkort med en GPU-vattenkylare eller vid byte av värmeplattorna på en GPU-kylare, och hjälper till att bibehålla tillförlitlig kontakt över flera komponenter i samma uppsättning.

• Anpassar sig väl till höjdtoleranser
• Elektriskt icke-ledande
• Mycket mångsidig i användning
• Lätt att hantera

Idealisk när den exakta erforderliga plattjockleken är okänd, med värmeledningsförmåga som till och med kan öka vid högre kontakttryck.

Värmeplatta erbjuder exceptionellt hög kompressibilitet med utmärkt värmeledningsförmåga, utformad för att överbrygga varierande höjdskillnader över flera kontaktpunkter.

TG Minus Pad High Compression är särskilt praktisk vid modifiering av grafikkort med en GPU-vattenkylare eller vid byte av värmeplattor på en GPU-kylare, eftersom en typ av platta kan täcka komponenter som VRAM, spänningsregulatorer och andra kontaktytor i samma uppsättning.

• Mycket hög kompressibilitet
• Utmärkt värmeledningsförmåga, även under kraftig kompression
• Anpassar sig väl till höjdtoleranser
• Elektriskt icke-ledande
• Lätt att hantera

Idealisk när exakt plattjocklek är osäker, och hjälper till att bibehålla tillförlitlig kontakt samtidigt som den kompenserar för toleranser.

Thermal Grizzly Minus Pad Extreme is a great choice for applications where renewing thermal paste is not an option. This is particularly useful when distances between the heat source and the heat sink need to be bridged - for example with memory chips and voltage converters. The silicone-based thermal pad has a consistency similar to modeling clay. Compared to Minus pad 8 the thermal conductivity was improved by about 260 %.

• Most excellent thermal conductivity
• No bleeding
• long-term stability
• high compression rate

The minus pad extreme is available in size 120 x 20 mm and 100 x 100 mm with thicknesses of 0,5mm, 1mm, 1,5mm, 2mm, 3mm. See variants for various sizes and thickness. 

NB: Due to the consistency only one-time use is recommended 

The practical AM5 Adapter & Offset Mounting Kit for AMD‘s socket AM5 motherboards includes cooler brackets for offset mounting of the CPU as well as adapter screws from UNC 6-32 to M3 and M4 threads respectively. The adapter screws can be used to mount CPU coolers that require an M3 or M4 thread instead of the UNC 6-32 thread of the mounting screws of the cooler bracket, as is the case with various AIOs or water coolers. With the offset brackets, compatible CPU coolers can optionally be mounted offset on the processor to optimise cooling performance. Since the introduction of the chiplet design in Ryzen CPUs, the hottest point of the heat spreader is no longer in the middle, but has been offset slightly downwards and, depending on the CPU, towards the edge.

Short back plate for AM5 motherboard, for mounting AM4 coolers with custom retaining kit on AM5, made from black anodised aluminium

The heat spreader of the Ryzen 7000 processors is very thick, which is partly due to compatibility with older CPU coolers for the AM4 socket. The unnecessary thickness of the heat spreader reduces thermal conductivity, so the CPUs operate at very high temperatures, around 95 degrees Celsius. By removing the heat spreader ("decap", "delidding"), the CPU cooler can be mounted directly on the chiplets of Ryzen 7000 CPU, which drastically reduces temperatures. To avoid damage to sensitive chips and prevent operational problems (e.g., RAM), Ryzen 7000 Direct Die Frame replaces Socket Actuation Mechanism (SAM) on motherboard.

Thermal pad with extremely high thermal conductivity and outstanding compressibility, electrically non-conductive and easy to apply for efficient heat transfer in electronic components.

The Minus Pad Pro builds on the proven Minus Pad 8 to deliver improved thermal performance and surface conformity, making it suitable for SSDs, GPU coolers, water-cooling blocks, voltage regulators and memory modules.

• Excellent thermal conductivity


• Outstanding compressibility for better surface contact


• Electrically non-conductive


• Easy to use and install


• Designed for use with SSDs, GPUs, water coolers and electronic components


• Part of the Minus Pad Basic, Advance and Pro series; further developed from Minus Pad 8

Gray material adapts to uneven surfaces to improve contact between components and heatsinks for more reliable heat transfer.

Värmeledande platta, svart (paket om 4)

Värmeledande platta, rödbrun

Thermal Grizzly Minus Pad Extreme is a great choice for applications where renewing thermal paste is not an option. This is particularly useful when distances between the heat source and the heat sink need to be bridged - for example with memory chips and voltage converters. The silicone-based thermal pad has a consistency similar to modeling clay. Compared to Minus pad 8 the thermal conductivity was improved by about 260 %.

• Most excellent thermal conductivity
• No bleeding
• long-term stability
• high compression rate

The minus pad extreme is available in size 120 x 20 mm and 100 x 100 mm with thicknesses of 0,5mm, 1mm, 1,5mm, 2mm, 3mm. See variants for various sizes and thickness. 

NB: Due to the consistency only one-time use is recommended 

Thermal Grizzly Minus Pad Extreme is a great choice for applications where renewing thermal paste is not an option. This is particularly useful when distances between the heat source and the heat sink need to be bridged - for example with memory chips and voltage converters. The silicone-based thermal pad has a consistency similar to modeling clay. Compared to Minus pad 8 the thermal conductivity was improved by about 260 %.

• Most excellent thermal conductivity
• No bleeding
• long-term stability
• high compression rate

The minus pad extreme is available in size 120 x 20 mm and 100 x 100 mm with thicknesses of 0,5mm, 1mm, 1,5mm, 2mm, 3mm. See variants for various sizes and thickness. 

NB: Due to the consistency only one-time use is recommended 

Thermal Grizzly Minus Pad Extreme is a great choice for applications where renewing thermal paste is not an option. This is particularly useful when distances between the heat source and the heat sink need to be bridged - for example with memory chips and voltage converters. The silicone-based thermal pad has a consistency similar to modeling clay. Compared to Minus pad 8 the thermal conductivity was improved by about 260 %.

• Most excellent thermal conductivity
• No bleeding
• long-term stability
• high compression rate

The minus pad extreme is available in size 120 x 20 mm and 100 x 100 mm with thicknesses of 0,5mm, 1mm, 1,5mm, 2mm, 3mm. See variants for various sizes and thickness. 

NB: Due to the consistency only one-time use is recommended 

AM5 M4-bakplattan är en valfri monteringsplatta som ersätter den ursprungliga AM5-bakplattan. Vissa CPU-kylare använder en monteringssats som levereras med M4-gängade skruvar. Dessa är inte kompatibla med UNC 6-32-gängan som används på AM5-bakplattan. Med AM5 M4-bakplattan kan lämpliga CPU-kylare, speciellt AiO-vattenkylare, användas.

The Intel 1851 Delid-Die-Mate Heater V1 is a specially designed heating element for the Intel 1851 Delid-Die-Mate V1. The heater raises the temperature of both the CPU and the delidder to 165°C, the necessary temperature for delidding. The operation is controlled via a control unit with an OLED display, which is connected to the heater with two cables. A laptop/smartphone charger with at least 65 watts of power and a USB Type-C connector, which is not included, is required for the heater to operate. A small amount of thermal paste is also needed.

Heating element for warming the CPU
Designed for the Intel 1851 Delid-Die-Mate V1
Follow the warning instructions!
Scope of Delivery:

1x Intel 1851 Delid-Die-Mate Heater V1
1x Angle wrench
1x TG Cleaning Wipes
1x Kryonaut, 1g
Warning Instructions:

Note: When delidding with the Intel 1851 Delid-Die-Mate V1, the CPU should be heated to 165°C (the melting point of indium is 157°C) to liquefy the indium, making it easier to remove the heat spreader. This minimizes mechanical stress on the chip and helps prevent damage. Otherwise, there is a high risk that the CPU could be damaged during delidding.

Caution: delidding a CPU can be dangerous. Any damaged caused by this will not be covered by warranty. Make sure to ressearch how to before trying. 

Thermal Grizzly Minus Pad Extreme is a great choice for applications where renewing thermal paste is not an option. This is particularly useful when distances between the heat source and the heat sink need to be bridged - for example with memory chips and voltage converters. The silicone-based thermal pad has a consistency similar to modeling clay. Compared to Minus pad 8 the thermal conductivity was improved by about 260 %.

• Most excellent thermal conductivity
• No bleeding
• long-term stability
• high compression rate

The minus pad extreme is available in size 120 x 20 mm and 100 x 100 mm with thicknesses of 0,5mm, 1mm, 1,5mm, 2mm, 3mm. See variants for various sizes and thickness. 

NB: Due to the consistency only one-time use is recommended 

Thermal pads offer extremely high thermal conductivity, outstanding compressibility, electrical insulation, and straightforward installation for efficient component cooling.

The Minus Pad Pro is the Pro-series thermal pad refined from the Minus Pad 8 to deliver improved thermal conductivity and compressibility for SSDs, GPU coolers, water blocks and electronic components.

• Excellent thermal conductivity


• Outstanding compressibility for tight contact


• Electrically non-conductive


• Easy to apply


• Suitable for SSDs, GPU coolers, GPU water coolers, voltage regulators and memory modules

Designed to enhance heat transfer between components and cooling solutions in compact assemblies.

The 12th Gen Lapping-Tool is specially designed for the Intel 12th Gen Contact Frame and simplifies the process of lapping the processor. Using the enclosed screws, the CPU is simply mounted on the Lapping-Tool with the Contact Frame. This simulates the actual final position of the CPU in the socket on the motherboard.

Thermal Grizzly Minus Pad Extreme is a great choice for applications where renewing thermal paste is not an option. This is particularly useful when distances between the heat source and the heat sink need to be bridged - for example with memory chips and voltage converters. The silicone-based thermal pad has a consistency similar to modeling clay. Compared to Minus pad 8 the thermal conductivity was improved by about 260 %.

• Most excellent thermal conductivity
• No bleeding
• long-term stability
• high compression rate

The minus pad extreme is available in size 120 x 20 mm and 100 x 100 mm with thicknesses of 0,5mm, 1mm, 1,5mm, 2mm, 3mm. See variants for various sizes and thickness. 

NB: Due to the consistency only one-time use is recommended 

Thermal pad delivering excellent thermal conductivity and outstanding compressibility while remaining electrically non-conductive and easy to apply.

The Minus Pad Pro is part of the Minus Pad series, developed from the proven Minus Pad 8 to boost thermal performance and compressibility for components such as SSDs, GPU coolers, GPU water-cooling setups, voltage regulators and memory modules.

• Excellent thermal conductivity for efficient heat transfer


• Outstanding compressibility for tight-gap filling


• Electrically non-conductive for safe use on electronics


• Easy to use and install


• Color: gray

Provides a reliable thermal interface between electronic components and cooling solutions to enhance heat dissipation in compact assemblies.

Thermal pad with extremely high thermal conductivity, outstanding compressibility and electrical non-conductivity for reliable heat transfer on SSDs, GPU coolers and electronic components.

The Minus Pad Pro is part of the Minus Pad series and builds on the proven Minus Pad 8 to deliver improved thermal conductivity and compressibility while remaining easy to use.

• Excellent thermal conductivity


• Outstanding compressibility


• Easy to use


• Electrically non-conductive


• Suitable for SSDs, GPU coolers, GPU water coolers, voltage regulators and memory modules


• Color: gray

Provides a compressible, electrically isolating interface to enhance thermal contact between components and cooling solutions.

Thermal pads offering extremely high thermal conductivity, outstanding compressibility and electrically non-conductive properties for use on SSDs, GPU coolers and electronic components.

The Minus Pad Pro combines excellent heat transfer with exceptional compressibility while remaining electrically non-conductive, making it suitable for cooling SSDs, GPU coolers, GPU water coolers, voltage regulators and memory modules.

• Excellent thermal conductivity


• Outstanding compressibility for tight contact


• Electrically non-conductive for safe use on electronics


• Easy to use


• Designed for SSDs, GPU coolers, GPU water coolers, voltage regulators and memory modules

Based on the proven Minus Pad 8 and developed to further improve thermal conductivity and compressibility for reliable component cooling.

Värmeledande platta, rödbrun

Värmeledande platta, rödbrun