Thermal Grizzly - sita 3

Thermal Grizzly Minus Pad 8 - 30×30×1.5mm - Termisk platta

Thermal Grizzly Minus Pad 8 - 100×100×0.5mm - Termisk platta

Thermal Grizzly Minus Pad Basic - 100x100x1.0 mm 2 pcs - Termisk platta

Thermal Grizzly AM5 Adapter & Offset Mounting Kit - Modding

Thermal Grizzly Minus Pad HC 120x100x2 mm 2 pcs

Värmeplatta ger exceptionellt hög kompressibilitet med utmärkt värmeledningsförmåga, utformad för att anpassa sig till varierande höjdskillnader mellan komponenter.

TG Minus Pad High Compression är särskilt praktisk för grafikkortsmodifikationer med en GPU-vattenkylare eller vid byte av plattor på en GPU-kylare, eftersom en platta kan överbrygga flera toleranser på VRAM, spänningsregulatorer och andra kontaktytor i samma uppsättning.

• Behåller värmeledningsförmågan under kraftig kompression och kan öka vid högre kontakttryck
• Anpassar sig väl till höjdtoleranser när exakt plattjocklek är okänd
• Elektriskt icke-ledande
• Lätt att hantera och mycket mångsidig i användning

Ger tillförlitlig kontakt över ojämna ytor för mer konsekvent värmeöverföring i krävande byggen.

Thermal Grizzly WireView Pro GPU

En enhet för övervakning av GPU-ström mäter grafikkortets strömförbrukning via 12VHPWR-kontakten, visar värden på en OLED-skärm och lägger till kontaktdetektering, temperatursensorer och ett akustiskt larm.

Thermal Grizzly 90° WireView Pro GPU ansluts mellan GPU:ns 12VHPWR-strömkontakt och nätaggregatets kabel och fungerar som en 90°-adapter för optimerad kabeldragning samtidigt som den registrerar och visar effekt-, spännings-, ström- och temperaturvärden.

• OLED-skärm med knappstyrd växling mellan mätvärden
• Mätning och registrering av strömförbrukning, inklusive detektering av effekttoppar
• Interna sensorer vid strömkontakterna samt två externa 10K NTC-temperatursensorer
• Kontaktdetektering identifierar 150W, 300W, 450W eller 600W strömkabelspecifikation
• Justerbara temperatur- och strömtrösklar med summerlarm vid felaktiga eller lösa anslutningar

Få tydligare insikt i GPU:ns strömbeteende och kontakttemperaturer samtidigt som 12VHPWR-kabelhanteringen hålls ren och kontrollerad.

Thermal Grizzly Conductonaut Extreme (Liquid Metal) - 5g - Kylpasta

Thermal Grizzly Delid-Die-Mate For Intel 12th & 13th Gen - Modding

Thermal Grizzly AM5 Short Backplate Black - CPU monteringsfästen

Thermal Grizzly Intel High Performance Heatspreade

The Intel High Performance Heatspreader V1 is an upgrade heatspreader for Intel processors. The nickel-plated copper heatspreader has a 207 percent larger, diamond-milled precision surface. This increased surface area compared to the original heatspreader enables maximum heat dissipation for air and water coolers, while the precision milling ensures extremely low surface roughness for the best contact with the heat sink.

The Intel High Performance Heatspreader V1 is compatible with the following processors:

Intel 12th Gen CPUs
Intel 13th Gen CPUs
Intel 14th Gen CPUs (200s)

Scope of delivery

1x Intel High Performance Heatspreader V1
4x pan-head screws UNC thread 3/8"
1x hexagon socket wrench 5/64"
1x angle wrench Torx T20
 

Thermal Grizzly WireView GPU 2 x 8-Pins PCI-E - Reversed

Thermal Grizzly AMD Mycro Direct-Die Pro RGB V1

Water cooler for direct‑die mounting on AMD AM5 CPUs featuring a nickel‑plated copper cold plate, a hybrid microfin structure with a jet plate for optimized flow and integrated ARGB lighting.

The AMD Mycro Direct-Die Pro is engineered for delidded AM5 processors, replacing the SAM and heatspreader to sit directly on the silicon while the nickel plating limits gallium-based liquid metal diffusion and the hybrid fin design reduces flow resistance.

• Direct‑die mounting for delidded CPUs (requires removal of Socket Actuation Mechanism)


• Nickel‑plated copper cold plate with two sizes of microfins and jet plate


• Annealed acrylic under an anodized aluminum cover to prevent stress cracks


• Digital ARGB LEDs under the cover, controlled via 3‑pin ARGB header (+5V/DATA/GND); LEDs illuminate the acrylic and G1/4 connectors


• G1/4‑inch connections for coolant lines


• Compatibility: generally compatible with Ryzen 9000 series including X3D variants; not compatible with Ryzen 5 7400F or Ryzen 8000G APUs (As of September 2025)


• Includes insulation sheet, 600 mbar pressure test report, mounting screws and wrenches

Provides direct‑die cooling with optimized flow and integrated lighting while the nickel plating reduces the need for repeated liquid‑metal applications.

Thermal Grizzly Putty Advance 100g - Termisk platta

Thermally conductive gap filler to replace GPU thermal pads, usable across an operating temperature range of -40°C to +120°C.

The TG Putty product line provides a thermally conductive compound in multiple formulations and content options for replacing thermal pads on GPU assemblies.

• Intended as a replacement for GPU thermal pads


• Operating temperature: -40°C to +120°C


• Available contents: 30 g and 100 g


• Formulations: Basic, Advance, Pro

Fills gaps between components to establish effective thermal contact where pads are typically used.

Thermal Grizzly Minus Pad Extreme - 100 X 100 X 2 mm - Termisk platta

Thermal Grizzly Minus Pad Extreme is a great choice for applications where renewing thermal paste is not an option. This is particularly useful when distances between the heat source and the heat sink need to be bridged - for example with memory chips and voltage converters. The silicone-based thermal pad has a consistency similar to modeling clay. Compared to Minus pad 8 the thermal conductivity was improved by about 260 %.

• Most excellent thermal conductivity
• No bleeding
• long-term stability
• high compression rate

The minus pad extreme is available in size 120 x 20 mm and 100 x 100 mm with thicknesses of 0,5mm, 1mm, 1,5mm, 2mm, 3mm. See variants for various sizes and thickness. 

NB: Due to the consistency only one-time use is recommended 

Thermal Grizzly Minus Pad Extreme - 100 X 100 X 1.5 mm - Termisk platta

Thermal Grizzly Minus Pad Extreme is a great choice for applications where renewing thermal paste is not an option. This is particularly useful when distances between the heat source and the heat sink need to be bridged - for example with memory chips and voltage converters. The silicone-based thermal pad has a consistency similar to modeling clay. Compared to Minus pad 8 the thermal conductivity was improved by about 260 %.

• Most excellent thermal conductivity
• No bleeding
• long-term stability
• high compression rate

The minus pad extreme is available in size 120 x 20 mm and 100 x 100 mm with thicknesses of 0,5mm, 1mm, 1,5mm, 2mm, 3mm. See variants for various sizes and thickness. 

NB: Due to the consistency only one-time use is recommended 

Thermal Grizzly Minus Pad 8 - 30×30×0.5mm - Termisk platta

Thermal Grizzly Minus Pad 8 - 30×30×2mm - Termisk platta

Thermal Grizzly Putty Pro 100g - Termisk platta

Thermally conductive gap filler to replace GPU thermal pads, with an operating temperature range of -40°C to +120°C.

TG Putty is a thermally conductive compound intended for GPU applications, offered in multiple sizes and performance variants.

• Replaces standard GPU thermal pads to bridge uneven surfaces


• Operating temperature: -40°C to +120°C


• Available contents: 30 g and 100 g


• Available variants: Basic, Advance, Pro


• Datasheet and technical information available for download

Ensures reliable thermal contact across gaps to support heat transfer between GPU components.

Thermal Grizzly Hydronaut - 7.8g - Kylpasta

Thermal Grizzly Carbonaut - 32x32mm - Termisk platta

Thermal Grizzly Conductonaut - 5g - Kylpasta

Thermal Grizzly KryoSheet thermal pad - 24 x 12 mm - Termisk platta

The graphene thermal pads of the Thermal Grizzly KryoSheet series can be used as an excellent alternative for thermal compounds from the higher performance segment. Similar to Carbonaut pads, they have a conformable surface with very high thermal conductivity. Compared to Carbonaut pads, KryoSheet as a high-end product offers significantly higher thermal conductivity.

This increased thermal conductivity is not only due to the choice of material, but also to the innovative manufacturing process. KryoSheet does not contain any liquid components and is therefore not subject to normal ageing as is the case with traditional thermal paste. Drying out is not possible.

• Outstanding thermal conductivity
• Easy to use
• Consistently high performance
• Extreme durability

Attention: Electrically conductive! Follow instructions!

Thermal Grizzly Mycro Direct-Die CPU Watercooler with RGB

Thermal Grizzly Kapton Insulation Sheet

Kapton Insulation Sheet is a polyamide film that can be used at high temperatures up to 280 degrees Celsius and acts as an assembly aid for electrically conductive thermal interface material (TIM). It is ideal for covering components such as SMDs on a CPU or GPU if they are to be used with Conductonaut liquid metal, Carbonaut or KryoSheet.

Brief Informations:

• 50 adhesive strips 10x60mm
• Thickness of 40µm
• Electrically insulating
• Max Temp: 280°C
• Breakdown voltage: Over 1 kV
• Clean the adhesive surface beforehand!

Scope of delivery

• 10x carrier foil with  5 Kapton Insulation Sheets each
   

Thermal Grizzly Intel 1851 Delid-Die-Mate Heater

The Intel 1851 Delid-Die-Mate Heater V1 is a specially designed heating element for the Intel 1851 Delid-Die-Mate V1. The heater raises the temperature of both the CPU and the delidder to 165°C, the necessary temperature for delidding. The operation is controlled via a control unit with an OLED display, which is connected to the heater with two cables. A laptop/smartphone charger with at least 65 watts of power and a USB Type-C connector, which is not included, is required for the heater to operate. A small amount of thermal paste is also needed.

Heating element for warming the CPU
Designed for the Intel 1851 Delid-Die-Mate V1
Follow the warning instructions!
Scope of Delivery:

1x Intel 1851 Delid-Die-Mate Heater V1
1x Angle wrench
1x TG Cleaning Wipes
1x Kryonaut, 1g
Warning Instructions:

Note: When delidding with the Intel 1851 Delid-Die-Mate V1, the CPU should be heated to 165°C (the melting point of indium is 157°C) to liquefy the indium, making it easier to remove the heat spreader. This minimizes mechanical stress on the chip and helps prevent damage. Otherwise, there is a high risk that the CPU could be damaged during delidding.

Caution: delidding a CPU can be dangerous. Any damaged caused by this will not be covered by warranty. Make sure to ressearch how to before trying.