The graphene thermal pads of the Thermal Grizzly KryoSheet series can be used as an excellent alternative for thermal compounds from the higher performance segment. Similar to Carbonaut pads, they have a conformable surface with very high thermal conductivity. Compared to Carbonaut pads, KryoSheet as a high-end product offers significantly higher thermal conductivity.

This increased thermal conductivity is not only due to the choice of material, but also to the innovative manufacturing process. KryoSheet does not contain any liquid components and is therefore not subject to normal ageing as is the case with traditional thermal paste. Drying out is not possible.

• Outstanding thermal conductivity
• Easy to use
• Consistently high performance
• Extreme durability

Attention: Electrically conductive! Follow instructions!

Water cooler for direct‑die mounting on AMD AM5 CPUs featuring a nickel‑plated copper cold plate, a hybrid microfin structure with a jet plate for optimized flow and integrated ARGB lighting.

The AMD Mycro Direct-Die Pro is engineered for delidded AM5 processors, replacing the SAM and heatspreader to sit directly on the silicon while the nickel plating limits gallium-based liquid metal diffusion and the hybrid fin design reduces flow resistance.

• Direct‑die mounting for delidded CPUs (requires removal of Socket Actuation Mechanism)


• Nickel‑plated copper cold plate with two sizes of microfins and jet plate


• Annealed acrylic under an anodized aluminum cover to prevent stress cracks


• Digital ARGB LEDs under the cover, controlled via 3‑pin ARGB header (+5V/DATA/GND); LEDs illuminate the acrylic and G1/4 connectors


• G1/4‑inch connections for coolant lines


• Compatibility: generally compatible with Ryzen 9000 series including X3D variants; not compatible with Ryzen 5 7400F or Ryzen 8000G APUs (As of September 2025)


• Includes insulation sheet, 600 mbar pressure test report, mounting screws and wrenches

Provides direct‑die cooling with optimized flow and integrated lighting while the nickel plating reduces the need for repeated liquid‑metal applications.

Kylpasta för processorkylfläns, silver

Termisk pasta, ljusgrå

CPU Contact Frame improves cooling by shifting contact pressure to the edges, preventing IHS concavity and enabling better cooler contact on Intel LGA1700 sockets.

The Thermal Grizzly CPU Contact Frame Intel 1700 LT is the injection-molded "Lite" mounting frame made from ABS reinforced with 15% glass fiber that replaces the standard ILM to increase contact surface and simplify installation.

• Injection-molded ABS with 15% glass fiber for added stability


• Inner contour shifts pressure from centre to edges to avoid concave IHS


• Designed for Intel LGA1700; compatible with 12th, 13th and 14th Gen CPUs


• Only for CPUs whose IHS has been ground down by no more than 0.2 mm


• Includes 4 pan-head screws (UNC 3/8"), 5/64" hex socket wrench and Torx T20 angle wrench

Simple installation and improved cooler contact can lead to noticeably lower CPU temperatures depending on the cooler and processor.

The Delid-Die-Mate Intel 13th Gen is a tool for removing the heat spreader ("delidden") on Intel processors for socket LGA1700. By removing the heat spreader, the CPUs can be cooled via "direct die", for example. With the so-called "direct die", the CPU cooler is mounted directly on the processor chip. By omitting the heat spreader in the cooling circuit, a significantly optimised heat transfer from the die to the CPU cooler is possible.

The electrically non-conductive Minus Pad Advanced thermal pads are part of the Minus Pad Basic, Advance, and Pro series. Based on the proven minus pad 8, this series has been specifically further developed to significantly improve thermal conductivity, compressibility, and price-performance ratio. The thermal pads are suitable for SSDs, GPU coolers, GPU water coolers, as well as electronic components such as voltage regulators and memory modules.

• Excellent thermal conductivity


• High compressibility


• Easy to use


• Electrically non-conductive

Comparison of the Minus Pad Basic-, Advance-, and Pro series:

• Minus Pad Basic: Good thermal conductivity, slightly lower compressibility, and excellent price-performance ratio.


• Minus Pad Advance: Improved thermal conductivity, higher compressibility.


• Minus Pad Pro: Outstanding thermal conductivity and exceptional compressibility – at a slightly higher Price.
   

GPU power monitoring device measures and records graphics card power through the 12VHPWR connector, displays real-time watts/volts/amps on an OLED, detects connector type, monitors temperatures and issues an audible alarm for over-current, over-temperature or misconnected/incorrect cables.

Designed for in-line measurement, the WireView Pro GPU connects between the graphics card and the PSU to log power usage with a 60-second averaging mode and to detect power peaks and incorrect cable specifications.

• OLED display showing current W, V, A, min/max, 60s average (RAVG) and total energy (Wh)


• Records power consumption for analysis and comparison, with a special 60-second measurement cycle


• Connector detection for 150 W / 300 W / 450 W / 600 W specified cables


• Internal temperature sensors at the power connectors plus two external 10K NTC sensors (5 cm and 20 cm included)


• Audible buzzer with adjustable temperature and current limits; warns on incorrect or loose cable connections


• Available in Normal and Reverse 12VHPWR orientations and connects to the PSU via the power cable

Be aware that the WireView PCB and connectors can become very hot during use—up to about 60°C with air-cooled cards and up to 100°C with water-cooled cards without airflow—so allow it to cool before handling.

Device for measuring and monitoring graphics card power consumption via the 12VHPWR connector with OLED readout, connector detection, temperature sensors and an audible alarm.

The WireView Pro GPU connects between the graphics card and the power supply to display and record volts, amps and watts on an OLED screen while detecting cable specification and issuing warnings for incorrect connections, overcurrent or overheating.

• Displays current power (W), voltage (V), current (A), min/max, 60‑second average (RAVG) and total energy (Wh)


• Measures and records power only through the 12VHPWR power connector (does not measure via the motherboard PCIe slot)


• Connector detection for 150W / 300W / 450W / 600W cable specs; available in Normal and Reverse pin orientations


• Internal temperature sensors at the power connectors plus two external 10K NTC sensors with 5 cm and 20 cm cables


• Audible buzzer alerts for incorrect cables/connections, exceeded temperature limits or adjustable current limits


• Aluminum housing with optimized cable management and an OLED for quick, review‑friendly measurements

Useful for assessing GPU power use and detecting power peaks on high‑power cards; the device can become very hot during operation, so avoid touching the casing and allow it to cool after shutdown.

Värmeledande platta, rödbrun (paket om 2 )

Water cooler optimized for Intel LGA1851 direct-die mounting with a nickel-plated copper microfin cold plate, low-flow-resistance jet channels and integrated RGB lighting.

The Intel 1851 Mycro Direct-Die Pro RGB V1 is designed to sit directly on a delidded Intel CPU to send heat straight into the water loop, with an acrylic-and-aluminum cover and controllable ARGB illumination.

• Direct-die installation for LGA1851 CPUs — requires removal of the ILM and CPU heatspreader; delidding is at your own risk


• Nickel-plated copper cold plate with microfins and a jet system, engineered for low flow resistance


• Acrylic layer tempered after milling to prevent stress cracks beneath the anodized aluminum lid


• Digital aRGB LEDs under the lid, controllable via a 3-pin ARGB header (+5V/DATA/GND); LEDs also illuminate the G1/4 fittings


• G1/4-inch female threading for standard fittings


• Tested with KryoSheet and thermal pads — additional pad thickness affected contact pressure and showed no significant temperature improvements

Built for users who want a compact direct cooling path from the CPU die into a water loop while retaining customizable RGB lighting.

Thermal paste

TG Cleaning Wipes are cleaning cloths for cleaning surfaces so that thermal conductive materials such as thermal pastes or liquid metal can adhere well and thus develop their full thermal conductivity. Assembly aids such as the TG Kapton Insulation Sheet or the TG Shield protective coating also adhere better to cleaned surfaces. TG Cleaning Wipes are packaged as a practical complete set of 10 cleaning cloths.

The electrically non-conductive Minus Pad Advanced thermal pads are part of the Minus Pad Basic, Advance, and Pro series. Based on the proven minus pad 8, this series has been specifically further developed to significantly improve thermal conductivity, compressibility, and price-performance ratio. The thermal pads are suitable for SSDs, GPU coolers, GPU water coolers, as well as electronic components such as voltage regulators and memory modules.

• Excellent thermal conductivity


• High compressibility


• Easy to use


• Electrically non-conductive

Comparison of the Minus Pad Basic-, Advance-, and Pro series:

• Minus Pad Basic: Good thermal conductivity, slightly lower compressibility, and excellent price-performance ratio.


• Minus Pad Advance: Improved thermal conductivity, higher compressibility.


• Minus Pad Pro: Outstanding thermal conductivity and exceptional compressibility – at a slightly higher Price.
   

Thermal Grizzly TG Shield is a high temperature conformal coating to protect components from liquid metal short circuits. TG Shield is fast drying for quick application and will provide reliable protection of PC components in combination with liquid metal.

Thermal Grizzly TG Remove is an acetone based nano-cleaner for the best cleaning results of thermal paste. In addition TG Remove has a degreasing effect which helps preparing the surface for new application e. g. on CPUs.

Termisk pad Thermal Grizzly Minus Pad 8 är ett rosa 2-pack kyl tillbehör med 8 W/m-K värmeledningsförmåga för värmeavledning från GPU, M.2 SSD och VRM.

Den är utformad för att överbrygga glapp mellan värmealstrande elektroniska komponenter och kylflänsar eller kyl ytor, med en keramik-silikon-komplex med nano-aluminiumoxid.

• Elektriskt icke-ledande material
• Lämplig för GPU-kylflänsar, M.2 SSD-kylflänsar och VRM-kylning
• Drifttemperaturområde från -100 °C till +250 °C
• RoHS-kompatibel design

Pålitligt stöd för värmeöverföring hjälper din kyl lösning att fungera effektivt där komponenter och kylflänsar behöver korrekt kontakt.

Thermal Grizzly presenterar WireView GPU, en enhet för att mäta strömförbrukningen för PCI-expansion och plug-in-kort, som utvecklats i samarbete med Jon „elmor“ Sandström. Samtidigt möjliggör den U-formade designen av adaptern optimerad kabeldragning för ren kabelhantering.

Vad gör WireView GPU?
WireView GPU möjliggör mätning av strömförbrukningen för PCI-expansion och plug-in-kort och loggar dessa data för att fastställa strömförbrukningen. Dessa data kan bland annat användas för att bestämma strömkostnaderna för ett grafikkort eller för att jämföra strömförbrukningen med andra grafikkort - och det ser helt enkelt coolt ut!

- 2 x 8-Pins PCI-E - normal riktning

Termisk pasta, ljusgrå

Kylpasta för processorkylfläns, silver

Thermal pads provide improved thermal conductivity and high compressibility for efficient heat transfer in SSDs, GPU coolers, water coolers and other electronic components.

The electrically non-conductive Minus Pad Advance builds on the proven Minus Pad 8 design and was developed to improve thermal conductivity and compressibility while remaining easy to use.

• Excellent thermal conductivity


• High compressibility for uneven surfaces


• Easy to apply and handle


• Electrically non-conductive


• Suitable for SSDs, GPU coolers, GPU water coolers, voltage regulators and memory modules

Designed for straightforward installation, these pads help maintain effective thermal contact across a range of PC and electronics cooling applications.

Värmeledande platta, rödbrun

Grease spatula (paket om 3)

The electrically non-conductive Minus Pad Advanced thermal pads are part of the Minus Pad Basic, Advance, and Pro series. Based on the proven minus pad 8, this series has been specifically further developed to significantly improve thermal conductivity, compressibility, and price-performance ratio. The thermal pads are suitable for SSDs, GPU coolers, GPU water coolers, as well as electronic components such as voltage regulators and memory modules.

• Excellent thermal conductivity


• High compressibility


• Easy to use


• Electrically non-conductive

Comparison of the Minus Pad Basic-, Advance-, and Pro series:

• Minus Pad Basic: Good thermal conductivity, slightly lower compressibility, and excellent price-performance ratio.


• Minus Pad Advance: Improved thermal conductivity, higher compressibility.


• Minus Pad Pro: Outstanding thermal conductivity and exceptional compressibility – at a slightly higher Price.
   

Värmeplattor ger hög värmeledningsförmåga med en mycket elastisk, flexibel yta som är utformad för att kompensera även de minsta gliporna mellan komponenter.

Thermal Grizzly Minus Pad 8 är lätt att bearbeta och fästa med lätt tryck, med en keramisk silikonformelkomplex och nanoaluminiumoxid för att stödja konstant, optimal värmeöverföring i ett brett utbud av storlekar och tjocklekar.

• Hög värmeledningsförmåga
• Hög kompressibilitet
• Elektrisk isolering
• RoHS-kompatibel

Tillförlitlig kontakt och effektiv värmeöverföring hjälper till att hålla känsliga komponenter termiskt anslutna och stabila.