Thermal Grizzly – Kylpasta och kyllösningar för PC

The electrically non-conductive Minus Pad Advanced thermal pads are part of the Minus Pad Basic, Advance, and Pro series. Based on the proven minus pad 8, this series has been specifically further developed to significantly improve thermal conductivity, compressibility, and price-performance ratio. The thermal pads are suitable for SSDs, GPU coolers, GPU water coolers, as well as electronic components such as voltage regulators and memory modules.

• Excellent thermal conductivity


• High compressibility


• Easy to use


• Electrically non-conductive

Comparison of the Minus Pad Basic-, Advance-, and Pro series:

• Minus Pad Basic: Good thermal conductivity, slightly lower compressibility, and excellent price-performance ratio.


• Minus Pad Advance: Improved thermal conductivity, higher compressibility.


• Minus Pad Pro: Outstanding thermal conductivity and exceptional compressibility – at a slightly higher Price.
   

GPU power monitoring device measures and records graphics card power through the 12VHPWR connector, displays real-time watts/volts/amps on an OLED, detects connector type, monitors temperatures and issues an audible alarm for over-current, over-temperature or misconnected/incorrect cables.

Designed for in-line measurement, the WireView Pro GPU connects between the graphics card and the PSU to log power usage with a 60-second averaging mode and to detect power peaks and incorrect cable specifications.

• OLED display showing current W, V, A, min/max, 60s average (RAVG) and total energy (Wh)


• Records power consumption for analysis and comparison, with a special 60-second measurement cycle


• Connector detection for 150 W / 300 W / 450 W / 600 W specified cables


• Internal temperature sensors at the power connectors plus two external 10K NTC sensors (5 cm and 20 cm included)


• Audible buzzer with adjustable temperature and current limits; warns on incorrect or loose cable connections


• Available in Normal and Reverse 12VHPWR orientations and connects to the PSU via the power cable

Be aware that the WireView PCB and connectors can become very hot during use—up to about 60°C with air-cooled cards and up to 100°C with water-cooled cards without airflow—so allow it to cool before handling.

High-end thermal paste. Kryonaut thermal grease was created especially for the extremely demanding applications and the highest expectations of the overclocking community. Kryonaut is also highly recommended as a top product for critical cooling systems in the industrial environment.

• Designed for Overclocking
• Excellent thermal conductivity
• No curing
• Long-term durability
• No electrical conductivity!

Kryonaut uses a special structure, which halts the drying out process at temperatures of up to 80° Celsius. This structure is also responsible for the nano-aluminum- and zinc-oxide-parts included in the grease to compound optimally, to compensate for unevenness of the component (i.e. the CPU) or the heat sink, thus achieving remarkable heat transfer.
 

The PhaseSheet PTM is a thermal pad based on a phase change material (PCM). The pads, which are solid at room temperature, can be easily applied and liquefy during operation, allowing them to effectively dissipate heat like a thermal paste. PhaseSheet PTM is electrically non-conductive and can therefore be used in many areas, with the primary application being in processors and graphics chips.

Värmeledande platta, rödbrun (paket om 2 )

Thermal Grizzly Duronaut is a high-performance thermal paste designed for excellent heat transfer and long-term stability.

Key features:
✔ Extremely durable
✔ High thermal conductivity
✔ Non-conductive & safe for electronics

Package includes:

1x Duronaut thermal paste 6g
1x Applicator
1x TG Spatula
1x TG Spatula Pro
 

CPU contact frame for LGA 1851 (Intel 200 series). Can help improve cooling performance with better contact between CPU and cooler.

 Included in the package:

• 1x Intel 1851 CPU Contact Frame V1
• 4x Cylinder head screws with 3/8" UNC threads
• 1x 5/64" hex key
• 1x Torx T20 key

Thermal putty that serves as an electrically non-conductive, flexible gap filler for replacing thermal pads on GPUs and compensates for height differences from 0.2 to 3.0 mm.

TG Putty is easy to apply with the supplied spatulas or by hand (gloves recommended) and is available in Basic, Advance and Pro variants that differ by thermal conductivity.

• Electrically non-conductive alternative to conventional thermal pads


• Fills gaps from 0.2–3.0 mm for VRAM, VRM and SMD components


• Apply broadly with spatulas or shape into small pellets for precise placement


• Not suitable for use on processors (IHS or Direct Die) or directly on the GPU die


• Operating temperature range −40°C to +120°C


• Advance variant includes three spatulas for application

Designed for GPU modifications and cooler conversions, it adapts to varied factory pad thicknesses for tailored thermal contact.

Spatelsetet TG Spatula Pro (3-pack) säkerställer en jämn och exakt applicering av kylpasta på CPU:er, optimerat för att möjliggöra mer tryck vid utstrykning.

Dessa spatlar i mjuk plast är utformade för noggrann, jämn applicering av kylpastor med hög till mycket hög viskositet, minskar risken för repor eller ytskador och reagerar inte med metalliska komponenter i kylpastor.

• Praktiskt 3-pack
• Mjuk plast med lägre hårdhet än metallverktyg
• Slevliknande form för hög styvhet vid nedåtriktat tryck
• Kompatibel med Thermal Grizzly Duronaut, Aeronaut, Hydronaut, Kryonaut och Kryonaut Extreme

Hjälper till att uppnå en ren, konsekvent spridning för tillförlitliga resultat med kylpasta.

Flytande metall kylpasta, silverpasta, densitet: 6,29 g/cm³, driftstemperatur: -50 - 200° C, 1 gram

Thermal putty acts as an electrically non-conductive, flexible gap filler for replacing thermal pads on GPUs and compensates height differences from 0.2 mm to 3.0 mm while remaining easy to apply.

The TG Putty line is available in three variants with differing thermal conductivity and is supplied with spatulas to enable straightforward, large-area application.

• Electrically non-conductive alternative to conventional thermal pads


• Compensates gaps from 0.2–3.0 mm


• Three variants: Basic (medium), Advance (good), Pro (excellent) thermal conductivity


• Includes three spatulas for application


• Operating temperature range −40°C to +120°C


• Not suitable for use on processors (IHS or Direct Die) or directly on the GPU die


• Apply only to clean, degreased surfaces (e.g., TG Cleaning Wipes or isopropanol)

Suited for replacing VRAM and VRM pads on single and larger graphics cards and for converting coolers to GPU water cooling setups.

Värmeledande platta, rödbrun (paket om 2 )

Aeronaut thermal grease is the ideal beginner's product with high effectiveness. Great surface protection, as well as good heat transfer capabilites make Aeronaut the ideal choice for users who want to optimize their cooling solution in an effective way, or maybe want to use an alternative to the thermal grease included with their hardware, with a remarkable cost effectiveness to boot.

• very good thermal conductivity
• long-term durability
• no curing
• no electrical conductivity

TG Cleaning Wipes are cleaning cloths for cleaning surfaces so that thermal conductive materials such as thermal pastes or liquid metal can adhere well and thus develop their full thermal conductivity. Assembly aids such as the TG Kapton Insulation Sheet or the TG Shield protective coating also adhere better to cleaned surfaces. TG Cleaning Wipes are packaged as a practical complete set of 10 cleaning cloths.

Termisk pasta, ljusgrå

The electrically non-conductive Minus Pad Advanced thermal pads are part of the Minus Pad Basic, Advance, and Pro series. Based on the proven minus pad 8, this series has been specifically further developed to significantly improve thermal conductivity, compressibility, and price-performance ratio. The thermal pads are suitable for SSDs, GPU coolers, GPU water coolers, as well as electronic components such as voltage regulators and memory modules.

• Excellent thermal conductivity


• High compressibility


• Easy to use


• Electrically non-conductive

Comparison of the Minus Pad Basic-, Advance-, and Pro series:

• Minus Pad Basic: Good thermal conductivity, slightly lower compressibility, and excellent price-performance ratio.


• Minus Pad Advance: Improved thermal conductivity, higher compressibility.


• Minus Pad Pro: Outstanding thermal conductivity and exceptional compressibility – at a slightly higher Price.
   

Kylpasta för processorkylfläns, silver

Kylfläns för halvledarenhet (SSD), M.2 2280, svart

Thermal paste, designed for Overclocking, 14,2 W/m*K thermal conductivity, no curing, 33.84 grams

CPU kontakt tätningsram, röd/svart, svart

Del/tillbehör till datorns kylsystem Thermal Grizzly TG-GG-01 TG GPU Guard är en mycket komprimerbar skumpackning utformad för GPU-dies, som hjälper till att skydda närliggande komponenter vid användning av flytande metall eller andra elektriskt ledande termiska gränssnittsmaterial.

TG GPU Guard täcker ytmonterade komponenter (SMD:er) bredvid GPU:n och är något högre än GPU-dien, så att monteringstrycket komprimerar skummet för att överbrygga höjdskillnader mellan PCB och kylaren och hjälpa till att förhindra att kylpasta sprids till andra komponenter. Den begränsar också syreexponering för den flytande metallen för att öka dess livslängd och är galliumresistent.

• Mycket komprimerbar skumpackning för GPU-dies
• Skyddar elektroniska komponenter vid användning av ledande termiska gränssnittsmaterial
• Täcker SMD:er bredvid GPU:n och sitter något högre än GPU-dien
• Basmaterialhöjd 0.8 mm, komprimerbar ned till 0.15 mm
• Hjälper till att förhindra att flytande metall sprids till PCB-komponenter
• Galliumresistent

Idealisk för renare, säkrare applicering av flytande metall och mer hållbar termisk gränssnittsprestanda på grafikkort.

CPU Contact Frame improves cooling by shifting contact pressure to the edges, preventing IHS concavity and enabling better cooler contact on Intel LGA1700 sockets.

The Thermal Grizzly CPU Contact Frame Intel 1700 LT is the injection-molded "Lite" mounting frame made from ABS reinforced with 15% glass fiber that replaces the standard ILM to increase contact surface and simplify installation.

• Injection-molded ABS with 15% glass fiber for added stability


• Inner contour shifts pressure from centre to edges to avoid concave IHS


• Designed for Intel LGA1700; compatible with 12th, 13th and 14th Gen CPUs


• Only for CPUs whose IHS has been ground down by no more than 0.2 mm


• Includes 4 pan-head screws (UNC 3/8"), 5/64" hex socket wrench and Torx T20 angle wrench

Simple installation and improved cooler contact can lead to noticeably lower CPU temperatures depending on the cooler and processor.

Termisk pad Thermal Grizzly Minus Pad extreme 2 levererar enastående värmeledningsförmåga och lågt termiskt gränssnittsmotstånd för högpresterande tillämpningar.

Thermal Grizzly Minus Pad extreme 2 är utformad för att fylla även de minsta gliporna med värmeledande partiklar tack vare en sammansättning av aluminiumoxid, aluminiumhydroxid och aluminiumpulver, vilket främjar optimal värmeöverföring mellan värmekälla och kylare.

• Högpresterande termisk pad för extrema tillämpningar
• Optimerad materialsammansättning för lågt termiskt gränssnittsmotstånd
• Mjuk konsistens anpassar sig väl till kontaktytor
• Elektriskt icke-ledande
• Härdar eller stelnar inte över tid, även vid långvarig användning

Pålitligt gränssnittsmaterial för stabil, effektiv värmeöverföring i krävande byggen.

Thermal putty is an electrically non-conductive, flexible gap filler that replaces conventional thermal pads on GPUs and bridges height differences from 0.2 to 3.0 mm.

Formulated for GPU modifications, TG Putty is easy to shape for precise contact with VRAM and SMD components and can be applied broadly with a spatula or formed by hand.

• Electrically non-conductive alternative to thermal pads


• Fills gaps from 0.2 to 3.0 mm for consistent contact


• Apply with spatulas or by hand (gloves recommended)


• Available in variants with different thermal conductivities


• Operating range −40°C to +120°C


• Not suitable for use on processors (IHS or direct die) or directly on the GPU die

Easy to shape and tailor-made for memory and voltage-regulator contacts, it simplifies GPU pad replacement and cooler modifications.

CPU-kontaktram för Intel 13th Intel Raptor Lake och 14th gen Intel Raptor Lake-S, kan hjälpa till att förbättra kylprestanda med bättre kontakt mellan CPU och kylare - se installationsvideon innan du installerar